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Proceedings Paper

Bandwidth analysis of a microgyroscope vibrating in two orthogonal axes on the substrate plane
Author(s): Yoonshik Hong; Jong-Hyun Lee; Chang Seung Lee; Won-Ick Jang; Chang-Auck Choi; Soo Hyun Kim; Yoon Keun Kwak
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Paper Abstract

A microgyroscope, which vibrates in two orthogonal axes on the substrate plane, is designed and fabricated. The shuttle mass of the vibrating gyroscope consists of two parts. The one is outer shuttle mass which vibrates in driving mode guided by four folded sprints attached to anchors. And the other is inner shuttle mass which vibrates in driving mode as the outer frame does and also can vibrate in sensing mode guided by four folded springs attached to the outer shuttle mass. Due to the directions of vibrating modes, it is possible to fabricate the gyroscope with simplified process by using polysilicon on insulator structure. Fabrication processes of the microgyroscope are composed of anisotropic silicon etching by RIE, gas-phase etching of the buried sacrificial oxide layer, metal electrode formation. An electromechanical model of the vibrating microgyroscope was modeled and bandwidth characteristics of the gyroscope were analyzed firstly. The analyzed characteristics of the gyroscope were evaluated by experiment. The gyroscope operates at DC 4V and AC 0.1V in a vacuum chamber of 100mtorr. The detection circuit consists of a discrete sense amplifier and a noise canceling circuit. Using the evaluated electromechanical mode, an operating condition for high performance of the gyroscope is obtained.

Paper Details

Date Published: 10 March 1999
PDF: 9 pages
Proc. SPIE 3680, Design, Test, and Microfabrication of MEMS and MOEMS, (10 March 1999); doi: 10.1117/12.341161
Show Author Affiliations
Yoonshik Hong, Korea Advanced Institute of Science and Technology (South Korea)
Jong-Hyun Lee, Electronics and Telecommunications Research Institute (South Korea)
Chang Seung Lee, Electronics and Telecommunications Research Institute (South Korea)
Won-Ick Jang, Electronics and Telecommunications Research Institute (South Korea)
Chang-Auck Choi, Electronics and Telecommunications Research Institute (South Korea)
Soo Hyun Kim, Korea Advanced Institute of Science and Technology (South Korea)
Yoon Keun Kwak, Korea Advanced Institute of Science and Technology (South Korea)


Published in SPIE Proceedings Vol. 3680:
Design, Test, and Microfabrication of MEMS and MOEMS
Bernard Courtois; Wolfgang Ehrfeld; Selden B. Crary; Wolfgang Ehrfeld; Hiroyuki Fujita; Jean Michel Karam; Karen W. Markus, Editor(s)

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