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Proceedings Paper

Submicron defect detection by SEMSpec: an e-beam wafer inspection system
Author(s): Ning S. Chang
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Paper Abstract

Traditionally, automated optical inspection techniques have been sufficient to find defects on wafers. However, defects smaller than 0.25 (mu) simply cannot be resolved by light optics due to optical limitation. KLA-Tencor SEMSpec is an advanced scanning electron-beam wafer inspection system that can detect defects down to 0.1 (mu) . The electron beam is scanned over the specimen surface, causing secondary electrons to be emitted from the surface where the beam impinges. These emitted secondary electrons are detected and the resulting image is formed so that conventional image processing techniques can also be applied. In the inspection sequence, fundamental parameters such as pixel size, defect detection sensitivity threshold, signal averaging, and cluster distance can be adjusted.

Paper Details

Date Published: 8 March 1999
PDF: 6 pages
Proc. SPIE 3652, Machine Vision Applications in Industrial Inspection VII, (8 March 1999); doi: 10.1117/12.341147
Show Author Affiliations
Ning S. Chang, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 3652:
Machine Vision Applications in Industrial Inspection VII
Kenneth W. Tobin; Ning S. Chang, Editor(s)

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