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Proceedings Paper

Integrated waveguide/thermocouple sensor for liquid properties
Author(s): R. Daniel Costley; Gary Boudreaux; William G. Ramsey; Jason Simpson; Clinton Menezes
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Paper Abstract

A torsional and longitudinal waveguide was introduced several years ago and shown to be effective for measuring various properties of liquids, including viscosity, density and temperature. The instrument is simply a specially constructed, thin rod (waveguide), one end of which is inserted into the liquid slurry. Torsional or extensional waves are generated in the rod, via a magnetostrictive mechanism, by passing a current through a coil which fits over the dry end of the rod. Liquid properties are correlated to different attributes of the waves (e.g., speed and amplitude) that travel down the rod and reflect off the end that is inserted into the liquid. Different properties of the material can be determined using waveguides of different cross-section. Noncircular rods are used to measure density, while viscosity is measured with circular rods. Since temperature affects these same wave attributes it would be desirable to have an independent measure of the temperature. This is accomplished by using a thermocouple sheath as the sensor part of the waveguide. In this way, the influence of temperature can be decoupled from the other properties of interest. In addition, the temperature is measured at the same point where the other properties of the liquid are being measured. The basic design of the sensor will be presented along with experimental results.

Paper Details

Date Published: 4 February 1999
PDF: 9 pages
Proc. SPIE 3589, Process Control and Sensors for Manufacturing II, (4 February 1999); doi: 10.1117/12.339958
Show Author Affiliations
R. Daniel Costley, Mississippi State Univ. (United States)
Gary Boudreaux, Mississippi State Univ. (United States)
William G. Ramsey, Mississippi State Univ. (United States)
Jason Simpson, Mississippi State Univ. (United States)
Clinton Menezes, Mississippi State Univ. (United States)


Published in SPIE Proceedings Vol. 3589:
Process Control and Sensors for Manufacturing II
David M. Pepper, Editor(s)

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