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Proceedings Paper

In-situ noncontact nondestructive point-to-point microwave inspection system
Author(s): Vasundara V. Varadan; Richard D. Hollinger; Anikumar R. Tellakula; K. A. Jose; Vijay K. Varadan
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Paper Abstract

Discontinuities and manufacturing flaws affect system performance. The accurate location of flaws and defects is sometimes more important than its precise characterization. For mechanical structures, similarly sized flaws in certain locations are more critical than at other locations. Non- contact microwave inspection systems offer many advantages relative to traditional NDE techniques complex and nonplanar samples as well as composite or anisotropic materials, except where transmission through a metallic object is required. Using spot focused horn antennas, it is possible to detect, locate and identify the inhomogeneities inside dielectric materials with local resolution approaching one wavelength. The system can be completely automated under computer control. Inspection can be done purely in the reflect mode using only one antenna or in the transmission mode using two antennas. The antennas can move on a robotic arm or the system under inspection can move or rotate under the antenna. Surface profiling, shape profiling, and accurate non-contact thickness measurements can be performed in addition to locating flaws and delaminations. Inspection can be done in situ even in high temperature environments since this a non-contact method. Several different examples are presented to illustrate the efficacy of the method as an attractive, user friendly NDE tool.

Paper Details

Date Published: 4 February 1999
PDF: 8 pages
Proc. SPIE 3589, Process Control and Sensors for Manufacturing II, (4 February 1999); doi: 10.1117/12.339951
Show Author Affiliations
Vasundara V. Varadan, The Pennsylvania State Univ. and HVS Technologies, Inc. (United States)
Richard D. Hollinger, HVS Technologies, Inc. (United States)
Anikumar R. Tellakula, HVS Technologies, Inc. (United States)
K. A. Jose, The Pennsylvania State Univ. (United States)
Vijay K. Varadan, The Pennsylvania State Univ. and HVS Technologies, Inc. (United States)


Published in SPIE Proceedings Vol. 3589:
Process Control and Sensors for Manufacturing II
David M. Pepper, Editor(s)

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