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Proceedings Paper

Electroabsorption modulator packaging for greater than 20-GHz link applications
Author(s): David H. Boger; David M. Carberry; Elizabeth Twyford Kunkee; Heinrich Muller; Fernando D. Alvarez; Xenophon G. Glavas
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Paper Abstract

Efficient, linear, broadband optical modulators are an essential component in wide bandwidth optical links for high fidelity distribution and processing of wideband signals. We discuss the packaging issues and remedies for the packaging of electroabsorption modulators for greater than 20 GHz link applications. The EAM is a waveguide semiconductor quantum well device which we have demonstrated to have a excellent linearity and electrical to optical conversion efficiency. Several important issues require resolution in order to produce a high bandwidth, packaged product. These include temperature control, EAM back-side metallization, attachment of EAM to submount, Product hermeticity, alignment and attachment of input and output fibers to the device at sub- micron tolerances, retaining this alignment over operational temperatures and anticipated vibration environments, and elimination of outgassing materials that may serve as failure initiators to optical facets. This paper addresses these issues.

Paper Details

Date Published: 3 February 1999
PDF: 11 pages
Proc. SPIE 3541, Fiber Optic and Laser Sensors and Applications; Including Distributed and Multiplexed Fiber Optic Sensors VII, (3 February 1999); doi: 10.1117/12.339088
Show Author Affiliations
David H. Boger, TRW, Inc. (United States)
David M. Carberry, TRW, Inc. (United States)
Elizabeth Twyford Kunkee, TRW, Inc. (United States)
Heinrich Muller, TRW, Inc. (United States)
Fernando D. Alvarez, TRW, Inc. (United States)
Xenophon G. Glavas, TRW, Inc. (United States)

Published in SPIE Proceedings Vol. 3541:
Fiber Optic and Laser Sensors and Applications; Including Distributed and Multiplexed Fiber Optic Sensors VII
Alan D. Kersey; John P. Dakin; John P. Dakin; Alan D. Kersey; Dilip K. Paul, Editor(s)

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