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Proceedings Paper

Stencil mask technology for ion beam lithography
Author(s): Albrecht Ehrmann; Sabine Huber; Rainer Kaesmaier; Andreas B. Oelmann; Thomas Struck; Reinhard Springer; Joerg Butschke; Florian Letzkus; Karl Kragler; Hans Loeschner; Ivo W. Rangelow
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Paper Abstract

Ion beam lithography is one of the most promising future lithography technologies. A helium or hydrogen ion beam illuminates a stencil membrane mask and projects the image with 4X reduction to the wafer. The development of stencil masks is considered to be critical for the success of the new technology. Since 1997, within the European Ion Projection Lithography MEDEA (Microelectronic Devices for European Applications) project silicon stencil masks based on a wafer- flow process are developed. They are produced in a conventional wafer line. Six inch SOI (silicon-on-insulator) wafers are patterned with an e-beam wafer writing tool, then trenches are etched by plasma etching. Afterwards, the membrane is etched by wet etch using the SOI-oxide layer as an etch stop. The last step is to add a coating layer, which is sputtered onto the membrane. It protects the mask against ion irradiation damage. For metrology and inspection, methods used for conventional chromium masks as well as new techniques are investigated. Results from placement measurements on the Leica LMS IPRO tool will be presented. Finally, methods for CD measurement, defect inspection, repair and in-situ-cleaning in the stepper will be discussed, including experimental information of first tests.

Paper Details

Date Published: 18 December 1998
PDF: 12 pages
Proc. SPIE 3546, 18th Annual BACUS Symposium on Photomask Technology and Management, (18 December 1998); doi: 10.1117/12.332827
Show Author Affiliations
Albrecht Ehrmann, Siemens AG (Germany)
Sabine Huber, Siemens AG (Germany)
Rainer Kaesmaier, Siemens AG (Germany)
Andreas B. Oelmann, Siemens AG (Germany)
Thomas Struck, Siemens AG (Germany)
Reinhard Springer, Institute for Microelectronics (Germany)
Joerg Butschke, Institute for Microelectronics (Germany)
Florian Letzkus, Institute for Microelectronics (Germany)
Karl Kragler, Siemens AG (Germany)
Hans Loeschner, Ion Microfabrication Systems (Austria)
Ivo W. Rangelow, Univ. Kassel (Germany)


Published in SPIE Proceedings Vol. 3546:
18th Annual BACUS Symposium on Photomask Technology and Management
Brian J. Grenon; Frank E. Abboud, Editor(s)

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