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Proceedings Paper

Use of novel photoresists in the production of submillimeter-wave integrated circuits
Author(s): Chris Collins; Robert E. Miles; G. M. Parkhurst; John W. Digby; H. Kazemi; J. Martyn Chamberlain; R. D. Pollard; N. J. Cronin; Steven R. Davies; John W. Bowen; David Paul Steenson
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Paper Abstract

A new technique is reported for micro-machining millimeter and submillimeter-wave rectangular waveguide components using an advanced thick film UV photoresist known as EPONTM SU-8. The recent introduction of this resist has been of great interest to the millimeter-wave and terahertz micro-machining communities, as it is capable of producing features up to 1 mm in height with very high aspect ratios in only a single UV exposure. It therefore represents a possible low-cost alternative to the LIGA process. S-parameter measurements on the new rectangular waveguides show that they achieve lower loss than those produced using other on-chip fabrication techniques, they have highly accurate dimensions, are physically robust, and cheap and easy to manufacture.

Paper Details

Date Published: 13 November 1998
PDF: 5 pages
Proc. SPIE 3465, Millimeter and Submillimeter Waves IV, (13 November 1998); doi: 10.1117/12.331184
Show Author Affiliations
Chris Collins, Univ. of Nottingham (UK) and Univ. of Leeds (United Kingdom)
Robert E. Miles, Univ. of Leeds (United Kingdom)
G. M. Parkhurst, Univ. of Nottingham (United Kingdom)
John W. Digby, Univ. of Nottingham (United Kingdom)
H. Kazemi, Univ. of Bath (United Kingdom)
J. Martyn Chamberlain, Univ. of Nottingham (United Kingdom)
R. D. Pollard, Univ. of Leeds (United Kingdom)
N. J. Cronin, Univ. of Bath (United Kingdom)
Steven R. Davies, Univ. of Bath (United Kingdom)
John W. Bowen, Univ. of Reading (United Kingdom)
David Paul Steenson, Univ. of Leeds (United Kingdom)


Published in SPIE Proceedings Vol. 3465:
Millimeter and Submillimeter Waves IV
Mohammed N. Afsar, Editor(s)

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