Share Email Print

Proceedings Paper

Monolithic opto-electronic integration technologies for rf modules
Author(s): Richard J. Michalak
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Monolithic integration promises to deliver high-speed, mechanically robust, EMI-immune, low cost, light-weight, miniaturized RF modules for Air Force space-based sensors,and UAV and manned air vehicle sensor applications. This paper reviews several new approaches being investigated in the Air Force Research Laboratory's Photonics Center towards the monolithic integration of optical and electronic devices on silicon to form high-speed RF links and antenna elements. These include a completed in-house project to evaluate GaAsN light-emitting material latticed-matched to silicon, and funded programs to develop low-noise ring laser link sources flip-chip bonded onto silicon and also monolithically grown on GaP on silicon, and InGaAs sources and detectors grown on mis-oriented silicon CMOS via selective epitaxy. A new in-house technology application project is discussed.

Paper Details

Date Published: 3 November 1998
PDF: 12 pages
Proc. SPIE 3463, Photonics and Radio Frequency II, (3 November 1998); doi: 10.1117/12.330394
Show Author Affiliations
Richard J. Michalak, Air Force Research Lab. (United States)

Published in SPIE Proceedings Vol. 3463:
Photonics and Radio Frequency II
Gregory J. Zagar; Anastasios P. Goutzoulis; Andrew R. Pirich, Editor(s)

© SPIE. Terms of Use
Back to Top