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Proceedings Paper

Advancements in E-O framing
Author(s): Andre G. Lareau
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Paper Abstract

This paper reviews the origin, at the start of this decade, of Electro-Optic (E-O) framing technology. It follows the development of the 4-, 25-, and 50-Mpixel focal plane arrays (FPAs) which incorporate on-chip electronic forward motion compensation (FMC). These FPAs enable intelligence-quality performance under dynamic tactical maneuvers. Current technology has extended E-O framing into the infrared (IR) spectrum with the introduction of the world's largest IR FPA, a newly 4-Mpixel Platinum Silicide (PtSi) array. The future of E-O framing is being defined by two new United States patents announced in this paper. "Profiled" FMC provides the ability to enhance on-chip FMS using near real time image correlation. The process also yields a powerful "Precision Strike" capability by generating precision geo-location information which can be quickly transmitted to today's precision weapons. The second patent makes use of aircraft INS information to generate two-dimensional vectors. These vectors can be applied to a unique two-dimensional FPA image motion compensation architecture. Two-axis motion compensation improves the robustness of E-O framing cameras to dynamic aircraft maneuvers. The text describes compensation performance for rates of 30° per second in roll, and 10° per second in pitch and yaw with less than 2-pixels of blur over the entire array.

Paper Details

Date Published: 5 November 1998
PDF: 12 pages
Proc. SPIE 3431, Airborne Reconnaissance XXII, (5 November 1998); doi: 10.1117/12.330192
Show Author Affiliations
Andre G. Lareau, Recon/Optical, Inc. (United States)

Published in SPIE Proceedings Vol. 3431:
Airborne Reconnaissance XXII
Wallace G. Fishell; Arthur A. Andraitis; Michael S. Fagan; Jerry D. Greer; Mark C. Norton, Editor(s)

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