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Proceedings Paper

Defect data analysis for reticle inspection
Author(s): Ming-Huei Lin; Shen Chung Kuo
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Paper Abstract

When the IC design rule goes down to 0.25 micrometers or smaller, it brings many more difficulties in reticle manufacturing and inspection. For reticle inspection, the challenges come from the accuracy and sensitivity of inspection machines and defect classifications by the operators. In past few years, based on multiple inspection tools, TMC had developed the defect reviewing system to collect all inspection data and monitor/analyze them. The purpose is to integrate the scanning results from multiple machines and compensate for the loss of human judgments. This integrated methodology not only compares the defect locations among different machines and multiple scans, but also provides the statistics information to help us control the reticle quality.

Paper Details

Date Published: 1 September 1998
PDF: 7 pages
Proc. SPIE 3412, Photomask and X-Ray Mask Technology V, (1 September 1998); doi: 10.1117/12.328832
Show Author Affiliations
Ming-Huei Lin, Taiwan Mask Corp. (Taiwan)
Shen Chung Kuo, Taiwan Mask Corp. (Taiwan)


Published in SPIE Proceedings Vol. 3412:
Photomask and X-Ray Mask Technology V
Naoaki Aizaki, Editor(s)

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