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Proceedings Paper

Large-glass reticle writer: exposure strategy and mask handling
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Paper Abstract

The world semiconductor industry is currently preparing itself for the next evolutionary step in the ongoing development of the integrated circuit, characterized by the 0.18 micrometers technology. These circuits will invariably be produced using conventional optical lithography techniques, but based on advanced photomasks reticles, with the possible assistance of new lithography techniques such as phase shift and optical proximity correction. As such, these reticles will need to be built to very much tighter specifications, with more complex patterns, and at very much smaller geometries, then current technologies. To add to the already complex engineering task for the mask tool makers, the new SEMI reticle standard will introduce a 230 mm by 230 mm large and 9 mm thick quartz glass blank that will have a weight of above one kilogram. The production of these advanced masks is therefore identified as a key enabling technology which will stretch the capabilities of the manufacturing process, and its equipment, to the limit.

Paper Details

Date Published: 1 September 1998
PDF: 6 pages
Proc. SPIE 3412, Photomask and X-Ray Mask Technology V, (1 September 1998); doi: 10.1117/12.328804
Show Author Affiliations
Christian Ehrlich, Leica Microsystems Lithography GmbH (Germany)
Juergen Gramss, Leica Microsystems Lithography GmbH (Germany)


Published in SPIE Proceedings Vol. 3412:
Photomask and X-Ray Mask Technology V
Naoaki Aizaki, Editor(s)

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