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Proceedings Paper

Possibility of a spin cup method
Author(s): Terumasa Tokimitsu
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Paper Abstract

In reticle manufacturing process, error budget of CD uniformity includes error components caused from material process, exposure system, mask process and measurement technology. We examined error source coming from material process. In the previous paper, the variation of resists thickness was not so dominant to affect CD variation. But it is clear that the variation of resist thickness deeply affects CD linearity. We found that the variation of resists thickness is related to repeatability of fine patterns making such as an OPC structure. Because feature size of OPC patterns are almost as same as the smallest pattern size to be realized by current exposure systems.In this report we will show a method which is called 'spin cup' to achieve the sophisticated design for mask making as a resist coating machine maker. We hope it will be a solution to make mask which has highly accurate resist thickness.

Paper Details

Date Published: 1 September 1998
PDF: 10 pages
Proc. SPIE 3412, Photomask and X-Ray Mask Technology V, (1 September 1998); doi: 10.1117/12.328801
Show Author Affiliations
Terumasa Tokimitsu, Tazmo Co. Ltd. (Japan)


Published in SPIE Proceedings Vol. 3412:
Photomask and X-Ray Mask Technology V
Naoaki Aizaki, Editor(s)

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