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Proceedings Paper

Improved polysilicon surface-micromachined micromirror devices using chemical-mechanical polishing
Author(s): Dale L. Hetherington; Jeffry J. Sniegowski
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Paper Abstract

Surface polysilicon micromachined micromirrors require ultra-flat surfaces for advance optical applications such as adaptive optics. This paper details the planarization of micromirrors using chemical-mechanical polishing. We show that the increase in topography is due to a high temperature anneal step downstream for the CMP process itself. Two process alternatives were investigated: (1) perform a CMP step after the high temperature anneal step, and (2) perform a CMP step on a final polysilicon mirror surface. Both process alternatives produced acceptable flatness requirements for micromirror applications.

Paper Details

Date Published: 13 October 1998
PDF: 6 pages
Proc. SPIE 3440, Photonics for Space Environments VI, (13 October 1998); doi: 10.1117/12.326692
Show Author Affiliations
Dale L. Hetherington, Sandia National Labs. (United States)
Jeffry J. Sniegowski, Sandia National Labs. (United States)


Published in SPIE Proceedings Vol. 3440:
Photonics for Space Environments VI
Edward W. Taylor, Editor(s)

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