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Proceedings Paper

Strategy for a flexible and inexpensive defect density line monitoring for microchip manufacturing
Author(s): Friedbald Kiel; Olga Andrianaivo-Golz; Doron Solomon; Gerard Bekaert
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Paper Abstract

This article deals with the development of a defect density monitoring strategy for semiconductor mass production. We present an empirically justified defect density monitoring method which combines two complementary approaches. One approach works with statistical means and needs a high wafer and lot sampling rate and a systematic defect analysis and classification by review. The second approach fits more to the needs of immature production line in the development phase. The first is more conform to mature mass production. Our goal is to combine tool and product/process monitoring as well as to restrict the number of inspection gates to yield relevant levels, without losing reaction time for problems on intermediate process levels. At the same time the combination allows us to change the emphasis from monitoring with engineering character at the beginning of the lifetime of a production line towards a defect density control for mass production.

Paper Details

Date Published: 27 August 1998
PDF: 5 pages
Proc. SPIE 3509, In-Line Characterization Techniques for Performance and Yield Enhancement in Microelectronic Manufacturing II, (27 August 1998); doi: 10.1117/12.324412
Show Author Affiliations
Friedbald Kiel, Siemens (France)
Olga Andrianaivo-Golz, Siemens (France)
Doron Solomon, Applied Materials France (France)
Gerard Bekaert, IBM SA (France)


Published in SPIE Proceedings Vol. 3509:
In-Line Characterization Techniques for Performance and Yield Enhancement in Microelectronic Manufacturing II
Sergio A. Ajuria; Tim Z. Hossain, Editor(s)

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