Share Email Print
cover

Proceedings Paper

Recognition of defects of the surfscan installation TENCOR 7600 depending on the situation and size of the defect
Author(s): Sven-Olaf Schellenberg; Uwe Herdickerhoff
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The Surfscan installation is used to localize defects or irregularities on the surface of wafers. To simplify, particles with an expansion of >= 0.3 micrometers are recognized as a defect. The measuring principle of the installation is based on the comparisons of periodical structures. This means that only components of the same type are allowed on the wafer. A laser beam scans the surface of the wafer in a grid pattern, whereby the light is scattered on the structures and particles are registered by a photo- multiplier which is rotated by 90 degree against the incoming laser beam. As a rule these defects are not altogether spherical-symmetrical, so that the orientation and structure of the defect affect the intensity of the light scatter. As a defect is only illuminated from one side during measurement, various intensity values can be achieved by rotating the wafer. Therefore measurements with various wafer orientations were taken to assure that a possible defect is illuminated from all four sides. By using various intensity values information can be gained about the form, size and situation of a defect. Further the information can be used to obtain an optimal recipe design of a measurement procedure, and to better define the capture rate of the installation. This results in a more effective use of the installation.

Paper Details

Date Published: 28 August 1998
PDF: 8 pages
Proc. SPIE 3510, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (28 August 1998); doi: 10.1117/12.324392
Show Author Affiliations
Sven-Olaf Schellenberg, ELMOS Elektronik in MOS-Technologie GmbH (Germany)
Uwe Herdickerhoff, ELMOS Elektronik in MOS-Technologie GmbH (Germany)


Published in SPIE Proceedings Vol. 3510:
Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV
Sharad Prasad; Hans-Dieter Hartmann; Tohru Tsujide, Editor(s)

© SPIE. Terms of Use
Back to Top