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Proceedings Paper

Failure modes in microelectronic packages
Author(s): Xun Qing Shi; Wei Zhou; Hock Lye John Pang; Zhenfeng P. Wang
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Paper Abstract

In this paper, a novel interferometric method with a wide range of sensitivities, called holography quasi projection moire method, is presented. It combines the features of the varied double projection moire method and the holographic interferometry method. This technique has been used to study the various failure modes, such as spallation, delamination, 1D buckle, 2D buckle, and crush, in microelectronic packaging film/substrate modules. The experimental phenomenon and fracture mechanism for various failure modes are presented and analyzed.

Paper Details

Date Published: 28 August 1998
PDF: 8 pages
Proc. SPIE 3510, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (28 August 1998); doi: 10.1117/12.324385
Show Author Affiliations
Xun Qing Shi, Gintic Institute of Manufacturing Technology (Singapore)
Wei Zhou, Nanyang Technological Univ. (Singapore)
Hock Lye John Pang, Nanyang Technological Univ. (Singapore)
Zhenfeng P. Wang, Gintic Institute of Manufacturing Technology (Singapore)


Published in SPIE Proceedings Vol. 3510:
Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV
Sharad Prasad; Hans-Dieter Hartmann; Tohru Tsujide, Editor(s)

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