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Proceedings Paper

Equipment challenges for a total material system change: enabling device manufacturing at 130 nm and below
Author(s): Alain S. Harrus; John Kelly; Ronald A. Powell
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Paper Abstract

ULSI circuit performance is constantly increasing, in sped, functionality and device density. This performance increase is supported by the constant development of new processes and new materials, on new equipment platforms, which support the demand for improved defect density and throughput. A key challenge for equipment infrastructure to continue to support this performance acceleration is the shortening of cycle time for equipment development and new material acceptance.

Paper Details

Date Published: 28 August 1998
PDF: 3 pages
Proc. SPIE 3510, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (28 August 1998); doi: 10.1117/12.324381
Show Author Affiliations
Alain S. Harrus, Novellus Systems (United States)
John Kelly, Novellus Systems (United States)
Ronald A. Powell, Novellus Systems (United States)

Published in SPIE Proceedings Vol. 3510:
Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV
Sharad Prasad; Hans-Dieter Hartmann; Tohru Tsujide, Editor(s)

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