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Proceedings Paper

Implementation of a standardized 0.35-μm WLR test vehicle
Author(s): Ehren Achee; Greg Petter; James Reedholm
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Paper Abstract

The first global demonstration of wafer-level reliability (WLR) test structure and methodology effectiveness is in progress. This action, initiated by an organization of fabless companies and concentrated on foundry service providers, represents a market-driven effort. WLR has been discussed, evaluated, promoted and even made a requirement in semiconductor IC procurement documents. This project utilizes a common suite of WLR structures fabricated at most commercial foundries to demonstrate the effectiveness of WLR structures for use as process monitors.

Paper Details

Date Published: 28 August 1998
PDF: 11 pages
Proc. SPIE 3510, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (28 August 1998); doi: 10.1117/12.324371
Show Author Affiliations
Ehren Achee, Reedholm Instruments Co. (United States)
Greg Petter, Reedholm Instruments Co. (United States)
James Reedholm, Reedholm Instruments Co. (United States)


Published in SPIE Proceedings Vol. 3510:
Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV
Sharad Prasad; Hans-Dieter Hartmann; Tohru Tsujide, Editor(s)

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