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Proceedings Paper

Industrial use of conductive adhesives for SMT assemblies
Author(s): M. G. Perichaud; Helene Fremont; M. Salagoity; C. Faure; Yves Danto
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Paper Abstract

Conductive adhesives are gaining interest against SnPb soldering in microelectronics assemblies. The aim of this study is to evaluate the use of conductive adhesives for industrial SMT assemblies. Hence, after a short description of the most common conductive adhesives in use, this paper presents how to settle parameters of stenciling and 'pick and place' machines ordinary used for solder joints; the temperature cure schedule of conductive adhesives is defined, and validate by physical and thermal analyses. Finally, the reliability is evaluated and failure mechanisms are pointed out.

Paper Details

Date Published: 28 August 1998
PDF: 8 pages
Proc. SPIE 3510, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (28 August 1998); doi: 10.1117/12.324370
Show Author Affiliations
M. G. Perichaud, Univ. de Bordeaux I (France)
Helene Fremont, Univ. de Bordeaux I (France)
M. Salagoity, Solectron (France)
C. Faure, Solectron (France)
Yves Danto, Univ. de Bordeaux I (France)

Published in SPIE Proceedings Vol. 3510:
Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV
Sharad Prasad; Hans-Dieter Hartmann; Tohru Tsujide, Editor(s)

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