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Proceedings Paper

Multivariate run-to-run control of arm-to-arm variations in chemical mechanical planarization
Author(s): W. Jarrett Campbell; Chris Raeder; Valerie Wenner; Thomas F. Edgar
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Paper Abstract

With the introduction of high-throughput, multi-arm chemical-mechanical planarization (CMP) tools, a new source of process variation is introduced to the CMP process. These arm-to-arm variations are caused by small differences in the polishing rates of each arm. Modeling the arm-to-arm interactions of a CMP tool allows the application of a model-based, multi-variable, run-to-run control scheme. This control scheme is an optimization-based approach using pilot wafers applied to 'out of control' processes.In addition, this paper outlines a controller that can be applied directly to production wafers. The production-based run-to- run controller allows for monitoring the process through statistical process control methods and utilizes known relationships between product and pilot wafer removal rates in order to keep the process 'in control'. The product-based controller will be automated and deployed in AMD's Fab25- micron facility in Austin, TX using the software developed under the Advanced Control Framework Initiative.

Paper Details

Date Published: 3 September 1998
PDF: 8 pages
Proc. SPIE 3507, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing IV, (3 September 1998); doi: 10.1117/12.324360
Show Author Affiliations
W. Jarrett Campbell, Advanced Micro Devices, Inc. (United States)
Chris Raeder, Advanced Micro Devices, Inc. (United States)
Valerie Wenner, Advanced Micro Devices, Inc. (United States)
Thomas F. Edgar, Univ. of Texas at Austin (United States)

Published in SPIE Proceedings Vol. 3507:
Process, Equipment, and Materials Control in Integrated Circuit Manufacturing IV
Anthony J. Toprac; Kim Dang, Editor(s)

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