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Proceedings Paper

Novel method to eliminate SOG-etching-back-induced random particle
Author(s): Chih-Hsieh F. Hsu; Chao-Hsin Chang; M. K. Yu; Y. S. Peng
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Paper Abstract

In the modern VLSI, SOG coating followed by SOG etching back process (SOG-ETB) has been an essential process and used for planarization in multilevel integration circuit manufacture. No clean treatment could be done after SOG-ETB process of Inter Metal Dielectric due to the concern of reliability. Consequently, the elimination of the particles of SOG-ETB is the only solution to overcome the production yield impact. The 'random particles' issue means that there were 'high flake type particles' induced at SOG-ETB stages and only dropped on few wafers within one lot. It was hard to catch this issue and to take action instantly. Several investigations were done to find out the source of 'random particles' and eliminate it by adopting an appropriate particle monitoring procedure to reflect the real SOG-ETB process machine status and modifying the replacement cycle of key parts.

Paper Details

Date Published: 3 September 1998
PDF: 9 pages
Proc. SPIE 3507, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing IV, (3 September 1998); doi: 10.1117/12.324356
Show Author Affiliations
Chih-Hsieh F. Hsu, Taiwan Semiconductor Manufacturing Co. (Taiwan)
Chao-Hsin Chang, Taiwan Semiconductor Manufacturing Co. (Taiwan)
M. K. Yu, Taiwan Semiconductor Manufacturing Co. (Taiwan)
Y. S. Peng, Taiwan Semiconductor Manufacturing Co. (Taiwan)

Published in SPIE Proceedings Vol. 3507:
Process, Equipment, and Materials Control in Integrated Circuit Manufacturing IV
Anthony J. Toprac; Kim Dang, Editor(s)

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