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Proceedings Paper

Development and testing of an active platen for IC manufacturing
Author(s): James M. Redmond; Pat Barney; Tony G. Smith; Joel R. Darnold
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Paper Abstract

The conflicting demands for finer features and increased production rates in integrated circuit manufacturing have emphasized the need for improved wafer positioning technology. In this paper we present operational test results from a magnetically levitated platen with structurally integrated piezoelectric actuators. The strain based actuators provide active damping of the platen's flexible body modes, enabling increased bandwidth on the mag-lev positioning system. Test result reveal a dramatic reduction in steady state positioning error and settling time through implementation of active vibration control.

Paper Details

Date Published: 3 September 1998
PDF: 7 pages
Proc. SPIE 3507, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing IV, (3 September 1998); doi: 10.1117/12.324353
Show Author Affiliations
James M. Redmond, Sandia National Labs. (United States)
Pat Barney, Sandia National Labs. (United States)
Tony G. Smith, Sandia National Labs. (United States)
Joel R. Darnold, Sandia National Labs. (United States)

Published in SPIE Proceedings Vol. 3507:
Process, Equipment, and Materials Control in Integrated Circuit Manufacturing IV
Anthony J. Toprac; Kim Dang, Editor(s)

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