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Proceedings Paper

Foundry technology trend
Author(s): Jack Y. C. Sun
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Paper Abstract

This paper gives an overview of the foundry technology trend in the future. The foundry model is a part of the natural trend toward the vertical disintegration of the semiconductor industry. Foundry technology is already in the lading pack, and will be on the leading edge from now on. Foundry technology will be market driven toward low voltage, low power, high performance, high density, and system on chip. Examples of leading-edge 0.25 um logic and 0.18 micrometers and beyond process features will be used to illustrate this trend.

Paper Details

Date Published: 3 September 1998
PDF: 6 pages
Proc. SPIE 3507, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing IV, (3 September 1998); doi: 10.1117/12.324346
Show Author Affiliations
Jack Y. C. Sun, Taiwan Semiconductor Manufacturing Co. (Taiwan)


Published in SPIE Proceedings Vol. 3507:
Process, Equipment, and Materials Control in Integrated Circuit Manufacturing IV
Anthony J. Toprac; Kim Dang, Editor(s)

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