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Proceedings Paper

SVG 8800 photoresist coater uniformity improvement using Shipley resist 3010
Author(s): Deborah Emielita
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Paper Abstract

This article presents a methodology used to obtain nearly identical photoresist thickness and uniformity results from four SVG 8800 coat tracks. The intent was to investigate the impact of equipment deviations on the resist thickness mean. The before-and-after paired comparison experimental design is the method of investigation used. Evaluation techniques include extensive use of the T-test to check the effect of the experiments upon thickness means. Variables in this study include: softbake temperature, cast spin sped, exhaust flow, two spin chuck types, resists sit time in the pump, arm retraction time, and resist dispense temperature. The sample sizes were sets of three to ten wafers per group. The most significant variable found was the arm retraction time. Any delay evaporated the solvent from the resist prior to the cast step resulting in a thicker measurement. Software modification to the arm program eliminated this effect. Additional findings include the effects of resist dispense temperature, resist sit time in the pump and type of spin chuck. A decrease in temperature lowers the resist thickness. Excessive sit time results in thinner resist values and a non-normal distribution of thickness. One chick type had slightly thicker resist values and more variation in thickness.

Paper Details

Date Published: 3 September 1998
PDF: 12 pages
Proc. SPIE 3507, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing IV, (3 September 1998); doi: 10.1117/12.324337
Show Author Affiliations
Deborah Emielita, Medtronic, Inc. (United States)


Published in SPIE Proceedings Vol. 3507:
Process, Equipment, and Materials Control in Integrated Circuit Manufacturing IV
Anthony J. Toprac; Kim Dang, Editor(s)

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