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Proceedings Paper

Flat-type metal residue-induced metal line bridge
Author(s): Hung-Chi Hsiao; Po-Tao Chu; Y.M. Hsu; Chia-Hsiang Chen
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Paper Abstract

As the device feature size continues to shrink, the restriction of particles size is more critical. More effective tools are needed to identify the shaped and the contents of particles, then take corrective actions. In this paper, the source and formation of the flat type metal residue that cause metal line bridge were identified by KLA scan defect inspector and optical microscope review. The duplication of this flat type metal residue also has been achieved. And the effective monitor tool is provided in the paper to prevent the particle forming.

Paper Details

Date Published: 3 September 1998
PDF: 7 pages
Proc. SPIE 3507, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing IV, (3 September 1998); doi: 10.1117/12.324336
Show Author Affiliations
Hung-Chi Hsiao, Taiwan Semiconductor Manufacturing Co. (Taiwan)
Po-Tao Chu, Taiwan Semiconductor Manufacturing Co. (Taiwan)
Y.M. Hsu, Taiwan Semiconductor Manufacturing Co. (Taiwan)
Chia-Hsiang Chen, Taiwan Semiconductor Manufacturing Co. (Taiwan)


Published in SPIE Proceedings Vol. 3507:
Process, Equipment, and Materials Control in Integrated Circuit Manufacturing IV
Anthony J. Toprac; Kim Dang, Editor(s)

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