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Proceedings Paper

Microfabrication of membrane-based devices by HARSE and combined HARSE/wet etching
Author(s): Ronald P. Manginell; Gregory C. Frye-Mason; W. Kent Schubert; Randy J. Shul; Christi Lober Willison
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Paper Abstract

Deep-reactive ion etching (DRIE) of silicon, also known as high-aspect-ratio silicon etching (HARSE), is distinguished by fast etch rates (approximately 3 micrometer/min), crystal orientation independence, anisotropy, vertical sidewall profiles and CMOS compatibility. By using through-wafer HARSE and stopping on a dielectric film placed on the opposite side of the wafer, freestanding dielectric membranes were produced. Dielectric membrane-based sensors and actuators fabricated in this way include microhotplates, flow sensors, valves and magnetically-actuated flexural plate wave (FPW) devices. Unfortunately, low-stress silicon nitride, a common membrane material, has an appreciable DRI etch rate. To overcome this problem HARSE can be followed by a brief wet chemical etch. This approach has been demonstrated using KOH or HF/Nitric/Acetic etchants, both of which have significantly smaller etch rates on silicon nitride than does DRIE. Composite membranes consisting of silicon dioxide and silicon nitride layers are also under evaluation due to the higher DRIE selectivity to silicon dioxide.

Paper Details

Date Published: 31 August 1998
PDF: 8 pages
Proc. SPIE 3511, Micromachining and Microfabrication Process Technology IV, (31 August 1998); doi: 10.1117/12.324310
Show Author Affiliations
Ronald P. Manginell, Sandia National Labs. (United States)
Gregory C. Frye-Mason, Sandia National Labs. (United States)
W. Kent Schubert, Sandia National Labs. (United States)
Randy J. Shul, Sandia National Labs. (United States)
Christi Lober Willison, Sandia National Labs. (United States)

Published in SPIE Proceedings Vol. 3511:
Micromachining and Microfabrication Process Technology IV
James H. Smith, Editor(s)

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