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Proceedings Paper

Novel and high-yield fabrication of electroplated 3D microcoils for MEMS and microelectronics
Author(s): Jun-Bo Yoon; Chul-Hi Han; Euisik Yoon; Choong-Ki Kim
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Paper Abstract

A novel and high-yield process is presented to fabricate electroplated 3D micro-coils for MEMS and microelectronics. The 3D Solenoid-type Integrated Inductor (SI2) is decomposed into two parts, bottom conductor lines and air bridges. The bridges are formed by only one electroplating step. This single-step fabrication of the electroplated air bridges is possible by forming the 3D photoresist mold with a Multi-Exposure and Single Development method (MESD). We have successfully demonstrated 3D micro-coils with or without a core. This method is so easy and simple that we can dramatically improve the fabrication yield, which is the hardest obstacle in the various 3D micro-coil fabrication methods. Also, this method has good IC process compatibility owing to low process temperature and the monolithic feature.

Paper Details

Date Published: 31 August 1998
PDF: 8 pages
Proc. SPIE 3511, Micromachining and Microfabrication Process Technology IV, (31 August 1998); doi: 10.1117/12.324306
Show Author Affiliations
Jun-Bo Yoon, Korea Advanced Institute of Science and Technology (South Korea)
Chul-Hi Han, Korea Advanced Institute of Science and Technology (South Korea)
Euisik Yoon, Korea Advanced Institute of Science and Technnology (South Korea)
Choong-Ki Kim, Korea Advanced Institute of Science and Technology (South Korea)


Published in SPIE Proceedings Vol. 3511:
Micromachining and Microfabrication Process Technology IV
James H. Smith, Editor(s)

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