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Proceedings Paper

Adhesion between PMMA mask layer and silicon wafer in KOH aqueous solution
Author(s): Mihaela Ilie; Bogdan Marculescu; Nicolae Moldovan; Nicoleta Nastase; Mihaela Olteanu
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Paper Abstract

The adhesion of PMMA layers on silicon wafer has been studied in order to protect the front side of the silicon wafer while etching the backside in KOH aqueous solution. Pre and post-bake treatment have been performed, different primers have been used to optimise the superficial and interfacial tension of both mask layer and substrate. An adherent layer has been obtained and its behaviour has been explained based on the polar and nonpolar interactions across the interface.

Keywords: PMMA, silicon, KOH, work of adhesion, surface energy, interfacial tension, superficial tension, contact angle.

Paper Details

Date Published: 1 September 1998
PDF: 9 pages
Proc. SPIE 3512, Materials and Device Characterization in Micromachining, (1 September 1998); doi: 10.1117/12.324086
Show Author Affiliations
Mihaela Ilie, National Institute for Research and Development in Microtechnology (Italy)
Bogdan Marculescu, Polytechnica Univ. of Bucharest (Romania)
Nicolae Moldovan, National Institute for Research and Development in Microtechnology (Romania)
Nicoleta Nastase, National Institute for Research and Development in Microtechnology (Romania)
Mihaela Olteanu, Univ. of Bucharest (Romania)


Published in SPIE Proceedings Vol. 3512:
Materials and Device Characterization in Micromachining
Craig R. Friedrich; Yuli Vladimirsky, Editor(s)

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