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Proceedings Paper

Foundry technology trend
Author(s): Jack Y. C. Sun
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Paper Abstract

This paper gives an overview of the foundry model and foundry technology trend in the future. The foundry model is a part of the natural trend toward the vertical dis-integration (or horizontal specialization) of the semiconductor industry. Foundry technology is already in the leading pack, and will be on the leading edge from now on. Foundry technology will be market driven toward low voltage (core), low power, high performance, high density, and system on chip (SOC). Examples of leading-edge 0.25 micrometer logic and 0.18 micrometer and beyond process features will be used to illustrate this trend.

Paper Details

Date Published: 4 September 1998
PDF: 6 pages
Proc. SPIE 3508, Multilevel Interconnect Technology II, (4 September 1998); doi: 10.1117/12.324036
Show Author Affiliations
Jack Y. C. Sun, Taiwan Semiconductor Manufacturing Co. (Taiwan)

Published in SPIE Proceedings Vol. 3508:
Multilevel Interconnect Technology II
Mart Graef; Divyesh N. Patel, Editor(s)

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