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Proceedings Paper

Technological modules for on-chip integration of sensors with electronics
Author(s): A. Goetz; Carles Cane
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Paper Abstract

Technological modules that are needed to fabricate sensors on CMOS wafers are discussed. None of the process steps of the CMOS technology are modified in order to guarantee that the electronics are not affected by the additional sensor process steps. The definition of standardized `add-on' sensor modules to the CMOS process of a foundry is intended to limit the development cost of smart sensors. The application of these modules to the fabrication of a CMOS multisensor chip is described.

Paper Details

Date Published: 8 September 1998
PDF: 12 pages
Proc. SPIE 3514, Micromachined Devices and Components IV, (8 September 1998); doi: 10.1117/12.323924
Show Author Affiliations
A. Goetz, Ctr. Nacional de Microelectronica (Spain)
Carles Cane, Ctr. Nacional de Microelectronica (Spain)

Published in SPIE Proceedings Vol. 3514:
Micromachined Devices and Components IV
Patrick J. French; Kevin H. Chau, Editor(s)

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