Share Email Print

Proceedings Paper

Simultaneous fabrication of dielectric and electric joints by wafer bonding
Author(s): Andreas Drost; Gerhard Klink; Sabine Scherbaum; Michael Feil
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Wafer bonding is a key technology for the fabrication of micro mechanical systems which consist of two or more stacked silicon parts. Among the different bonding methods anodic bonding with an intermediate layer of Pyrex glass offers several advantages concerning the process flexibility and the stability of the bond. To use this technology the sputter deposition process of Pyrex glass was optimized and the anodic bonding process was characterized. A process for a capacitive pressure sensor was designed which included bond frames made out of sputtered glass. The electrical contact from both electrodes to contact pads was realized by lateral and vertical feedthroughs. The latter were obtained by an Au-Au thermocompression bond which was simultaneously fabricated with the anodic bond.

Paper Details

Date Published: 8 September 1998
PDF: 10 pages
Proc. SPIE 3514, Micromachined Devices and Components IV, (8 September 1998); doi: 10.1117/12.323914
Show Author Affiliations
Andreas Drost, Fraunhofer-Institute for Solid State Technology (Germany)
Gerhard Klink, Fraunhofer-Institute for Solid State Technology (Germany)
Sabine Scherbaum, Fraunhofer-Institute for Solid State Technology (Germany)
Michael Feil, Fraunhofer-Institute for Solid State Technology (Germany)

Published in SPIE Proceedings Vol. 3514:
Micromachined Devices and Components IV
Patrick J. French; Kevin H. Chau, Editor(s)

© SPIE. Terms of Use
Back to Top