Share Email Print
cover

Proceedings Paper

Fabrication of micromachined microwave couplers by CMOS process
Author(s): Chienliu Chang; Jinhong Chio; Kaihsiang Yen; Peizen Chang; Sheyshi Lu
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Since the 0.6 micrometers SPTM (Single Polysilicon and Three Metals) process provided by TSMC (Taiwan Semiconductor Manufacturer Company) has three metal layers available, miscellaneous microwave passive components are feasible and easily fabricated. The aim of our study is to minimize the conventional microwave couplers by commercial CMOS process. Combining communication application and semiconductor technology, this study takes advantages as following: (1) Miniaturization of the microwave passive components is feasible by CMOS process. (2) Only small area is required. (3) Microwave characteristics can be tested on-wafer. (4) Almost following the commercial CMOS process provided by TSMC, there is no post-process.

Paper Details

Date Published: 8 September 1998
PDF: 10 pages
Proc. SPIE 3514, Micromachined Devices and Components IV, (8 September 1998); doi: 10.1117/12.323913
Show Author Affiliations
Chienliu Chang, National Taiwan Univ. (Taiwan)
Jinhong Chio, National Taiwan Univ. (Taiwan)
Kaihsiang Yen, National Taiwan Univ. (Taiwan)
Peizen Chang, National Taiwan Univ. (Taiwan)
Sheyshi Lu, National Taiwan Univ. (Taiwan)


Published in SPIE Proceedings Vol. 3514:
Micromachined Devices and Components IV
Patrick J. French; Kevin H. Chau, Editor(s)

© SPIE. Terms of Use
Back to Top