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Proceedings Paper

Self-aligned polysilicon MEMS-reduced mask count surface micromachining
Author(s): J. Mark Noworolski; Seth R. Sanders
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Paper Abstract

A self-aligned reduced mask count micromachined polysilicon on nitride (SAMPSON) surface micromachining process is introduced. The self-alignment fabrication concept enables rapid fabrication, improves yields, and reduces parasitic capacitance of MEM devices. For many MEM devices the SAMPSON process results in a one mask savings over more conventional approaches. As a demonstration of the fabrication technique a burst-proof surface micromachined polysilicon resonant pressure sensor is fabricated using the SAMPSON process. This pressure sensor does not require a sealed cavity. It is also insensitive to mechanical property variations of the structural material, rendering its response essentially temperature independent.

Paper Details

Date Published: 8 September 1998
PDF: 6 pages
Proc. SPIE 3514, Micromachined Devices and Components IV, (8 September 1998); doi: 10.1117/12.323904
Show Author Affiliations
J. Mark Noworolski, Univ. of California/Berkeley (United States)
Seth R. Sanders, Univ. of California/Berkeley (United States)

Published in SPIE Proceedings Vol. 3514:
Micromachined Devices and Components IV
Patrick J. French; Kevin H. Chau, Editor(s)

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