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Proceedings Paper

Wafer bonding with an adhesive coating
Author(s): Gerhard Klink; Bernhard Hillerich
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Paper Abstract

The assembly process for microelectromechanical systems often requires a wafer-joining process using low temperatures. In this work a bonding process investigated, which uses thin adhesive films to stack silicon wafers. The method can be extended to form patterned adhesive coatings using stamping technique. Characterization of the process has been carried out with respect to adhesion, hermeticity and chemical stability of the adhesive bond. In several applications this adhesive bonding process has been successfully applied to assemble sensors and actuators.

Paper Details

Date Published: 8 September 1998
PDF: 12 pages
Proc. SPIE 3514, Micromachined Devices and Components IV, (8 September 1998); doi: 10.1117/12.323903
Show Author Affiliations
Gerhard Klink, Fraunhofer-Institute for Solid State Technology (Germany)
Bernhard Hillerich, Fraunhofer-Institute for Solid State Technology (Germany)

Published in SPIE Proceedings Vol. 3514:
Micromachined Devices and Components IV
Patrick J. French; Kevin H. Chau, Editor(s)

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