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Proceedings Paper

Microassembly technologies for MEMS
Author(s): Michael B. Cohn; Karl F. Boehringer; J. Mark Noworolski; Angad Singh; Chris G. Keller; Kenneth A. Goldberg; Roger T. Howe
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Paper Abstract

Microassembly promises to extend MEMS beyond the confines of silicon micromachining. This paper surveys research in both serial and parallel microassembly. The former extends conventional `pick and place' assembly into the micro- domain, where surface forces play a dominant role. Parallel assembly involves the simultaneous precise organization of an ensemble of micro components. This can be achieved by microstructure transfer between aligned wafers or arrays of binding sites that trap an initially random collection of parts. Binding sites can be micromachined cavities or electrostatic traps; short-range attractive forces and random agitation of the parts serve to fill the sites. Microassembly strategies should furnish reliable mechanical bonds and electrical interconnection between the micropart and the target substrate or subassembly.

Paper Details

Date Published: 8 September 1998
PDF: 15 pages
Proc. SPIE 3514, Micromachined Devices and Components IV, (8 September 1998); doi: 10.1117/12.323891
Show Author Affiliations
Michael B. Cohn, Univ. of California/Berkeley (United States)
Karl F. Boehringer, Univ. of California/Berkeley (United States)
Univ. of Washington (United States)
J. Mark Noworolski, Univ. of California/Berkeley (United States)
Angad Singh, Univ. of California/Berkeley (United States)
Chris G. Keller, MEMS Precision Instruments (United States)
Kenneth A. Goldberg, Univ. of California/Berkeley (United States)
Roger T. Howe, Univ. of California/Berkeley (United States)

Published in SPIE Proceedings Vol. 3514:
Micromachined Devices and Components IV
Patrick J. French; Kevin H. Chau, Editor(s)

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