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Proceedings Paper

Micro-electro-optical devices in a five-level polysilicon surface-micromachining technology
Author(s): James H. Smith; M. Steven Rodgers; Jeffry J. Sniegowski; Samuel L. Miller; Dale L. Hetherington; Paul J. McWhorter; Mial E. Warren
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Paper Abstract

We recently reported on the development of a 5-level polysilicon surface micromachine fabrication process consisting of four levels of mechanical poly plus an electrical interconnect layer and its application to complex mechanical systems. This paper describes the application of this technology to create micro-optical systems-on-a-chip. These are demonstration systems, which show that give levels of polysilicon provide greater performance, reliability, and significantly increased functionality. This new technology makes it possible to realize levels of system complexity that have so far only existed on paper, while simultaneously adding to the robustness of many of the individual subassemblies.

Paper Details

Date Published: 8 September 1998
PDF: 6 pages
Proc. SPIE 3514, Micromachined Devices and Components IV, (8 September 1998); doi: 10.1117/12.323889
Show Author Affiliations
James H. Smith, Sandia National Labs. (United States)
M. Steven Rodgers, Sandia National Labs. (United States)
Jeffry J. Sniegowski, Sandia National Labs. (United States)
Samuel L. Miller, Sandia National Labs. (United States)
Dale L. Hetherington, Sandia National Labs. (United States)
Paul J. McWhorter, Sandia National Labs. (United States)
Mial E. Warren, Sandia National Labs. (United States)


Published in SPIE Proceedings Vol. 3514:
Micromachined Devices and Components IV
Patrick J. French; Kevin H. Chau, Editor(s)

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