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Proceedings Paper

Combined measurement of silicon microbeams by grating interferometry and digital holography
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Paper Abstract

In this paper the methodology and instrumentation for the investigation of the silicon microbeam behavior under tensile and bending loads are described. The tests are performed by means of Automated Grating Interferometry (AGI) and Digital Holography (DH). Both methods deliver a direct approach to a highly sensitive measurement of surface displacements. In combination with simulation tools (analytical or FEM models) the material parameters can be determined. Consequently the main aim of the measurements is to determine the three Cartesian components of the displacement vector.

Paper Details

Date Published: 29 September 1998
PDF: 10 pages
Proc. SPIE 3407, International Conference on Applied Optical Metrology, (29 September 1998); doi: 10.1117/12.323338
Show Author Affiliations
Werner P. O. Jueptner, Bremen Institut fuer Angewandte Strahltechnik GmbH (Germany)
Malgorzata Kujawinska, Warsaw Univ. of Technology (Poland)
Wolfgang Osten, Bremen Institut fuer Angewandte Strahltechnik GmbH (Germany)
Leszek A. Salbut, Warsaw Univ. of Technology (Poland)
Soenke Seebacher, Bremen Institut fuer Angewandte Strahltechnik GmbH (Germany)


Published in SPIE Proceedings Vol. 3407:
International Conference on Applied Optical Metrology
Pramod Kumar Rastogi; Ferenc Gyimesi, Editor(s)

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