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Proceedings Paper

Optical measurement methods for MEMS applications
Author(s): Volker Grosser; C. Bombach; Wolf Faust; Dietmar Vogel; Bernd Michel
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Paper Abstract

Modern microelectronics, microsystems (MEMS and MOEMS) and their components are characterized by high volume integration of a variety of materials and combinations of materials to realize very different and variable functions (sensor and actuator functions, signal processing, etc.). The reliability and the lifetime of these microproducts are strongly depending on the material properties and the thermo-mechanical design. So nondestructive optical measuring and inspection methods are widely used in the R&D process, in IC-fabrication, in manufacturing and in packaging of MEMS and microcomponents. In following some special applications are described.

Paper Details

Date Published: 29 September 1998
PDF: 8 pages
Proc. SPIE 3407, International Conference on Applied Optical Metrology, (29 September 1998); doi: 10.1117/12.323337
Show Author Affiliations
Volker Grosser, Fraunhofer Institute for Reliability and Microintegration (Germany)
C. Bombach, Fraunhofer Institute for Reliability and Microintegration (Germany)
Wolf Faust, Fraunhofer Institute for Reliability and Microintegration (Germany)
Dietmar Vogel, Fraunhofer Institute for Reliability and Microintegration (Germany)
Bernd Michel, Fraunhofer Institute for Reliability and Microintegration (Germany)


Published in SPIE Proceedings Vol. 3407:
International Conference on Applied Optical Metrology
Pramod Kumar Rastogi; Ferenc Gyimesi, Editor(s)

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