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Proceedings Paper

New applications of in-plane, shadow, and reflection moire methods
Author(s): Fu-Pen Chiang; M. L. Du; I. M. Kao
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Paper Abstract

This paper describes some recent applications of the classical moire methods. The first is the use of in-plane moire method to monitor crack tip strain during cyclic loading. A new model predicting the crack growth rate using crack tip strain as a parameter is proposed. The second is the development of a modified shadow moire method for mapping warpage of silicon wafers due to the presence of residual stress. Talbot effect is introduced to enhance the sensitivity of the shadow moire method. The third example is the use of a modified reflection moire method to monitor the quality of thin films deposited on substrates.

Paper Details

Date Published: 29 September 1998
PDF: 6 pages
Proc. SPIE 3407, International Conference on Applied Optical Metrology, (29 September 1998); doi: 10.1117/12.323300
Show Author Affiliations
Fu-Pen Chiang, SUNY/Stony Brook (United States)
M. L. Du, SUNY/Stony Brook (United States)
I. M. Kao, SUNY/Stony Brook (United States)


Published in SPIE Proceedings Vol. 3407:
International Conference on Applied Optical Metrology
Pramod Kumar Rastogi; Ferenc Gyimesi, Editor(s)

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