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Proceedings Paper

Three-axis microactuator for smart optical interconnect system
Author(s): Edward V. White; Mark D. Rogers; John M. Haake
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Paper Abstract

We propose the utilization of a Smart In-Package [Micro] ALigner (SIMPAL) to enable fiber optical sensors for thick walled composite structures. Fiber optic coupling is the barrier preventing single mode and multimode fiber optical sensors systems from being incorporated into composite structures. A fiber optic connector that has a MEMS in-package micro aligner, integrated optical detectors, and control electronics is proposed to overcome the incompatibility between structural manufacturing tolerances and fiber optic alignment tolerances. The SIMPAL technology will enable affordable optical connection with sub-micron alignment tolerances to be made after the fiber optics are machined off at the egress point during a standard trimming process. We have demonstrated and described the MEMS actuator part of the SIMPAL. This active part is a 3-axis active fiber optic micro-aligner small enough to fit into current electro-optical packages. The micro-aligner is fabricated on a silicon wafer with the high aspect MEMS/LIGA process technology. The electrically controllable actuators demonstrate the high force and displacements necessary for in-package alignment of a micro-optics. The integration of lenses, optical sensors and control electronics is proposed to realize a smart optical backplane interconnect system.

Paper Details

Date Published: 20 July 1998
PDF: 12 pages
Proc. SPIE 3328, Smart Structures and Materials 1998: Smart Electronics and MEMS, (20 July 1998); doi: 10.1117/12.320188
Show Author Affiliations
Edward V. White, Boeing North American (United States)
Mark D. Rogers, Boeing North American (United States)
John M. Haake, Nuvonyx, Inc. (United States)


Published in SPIE Proceedings Vol. 3328:
Smart Structures and Materials 1998: Smart Electronics and MEMS
Vijay K. Varadan; Paul J. McWhorter; Richard A. Singer; Michael J. Vellekoop, Editor(s)

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