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Proceedings Paper

Integrated packaging concept for an intelligent transducer
Author(s): Matthias Heschel; J. F. Kuhmann; Siebe Bouwstra; M. Amskov
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Paper Abstract

In this paper we present a stacking technology for an integrated packaging of an intelligent transducer which is formed by a micromachined silicon transducer and an integrated circuit chip. Transducer and circuitry are stacked on top of each other with an intermediate chip in between. The bonding of the transducer and the intermediate chip is done by flip chip solder bump bonding. The bonding between the above two-layer stack and the circuit chip is done by conductive adhesive bonding combined with gold studs. We demonstrate the stacking technologies on passive test chips rather than real devices and report on technological details.

Paper Details

Date Published: 20 July 1998
PDF: 9 pages
Proc. SPIE 3328, Smart Structures and Materials 1998: Smart Electronics and MEMS, (20 July 1998); doi: 10.1117/12.320187
Show Author Affiliations
Matthias Heschel, Technical Univ. of Denmark (Denmark)
J. F. Kuhmann, Technical Univ. of Denmark (Denmark)
Siebe Bouwstra, Technical Univ. of Denmark (Denmark)
M. Amskov, Danish Electronics Light and Acoustics (Denmark)

Published in SPIE Proceedings Vol. 3328:
Smart Structures and Materials 1998: Smart Electronics and MEMS
Vijay K. Varadan; Paul J. McWhorter; Richard A. Singer; Michael J. Vellekoop, Editor(s)

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