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Proceedings Paper

High-end low-cost microelectronic fabrication available through MOSIS
Author(s): Jennifer Peltier; Wes Hansford
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Paper Abstract

The MOSIS Service (located at the University of Southern California's Information Sciences Institute) offers a route to obtain custom designed, prototype quantities of ASICs, Multichip Modules (MCMs) and MEMs devices. Over the last few years the service added MIDAS (MCM Interconnect Designers Access Service) for MCM fabrication to the list of standard offerings. Thus a designer can now access domestic, high- volume IC and MCM production lines to obtain low-cost, prototype quantities of both. In addition custom MEMs fabrication is now supported in conjunction with the Microelectronics Center of North Carolina. This unique resource is available to all users including commercial, government and university. The low-cost environment exists via a multi-project environment, where users share the cost of NRE, masks, and fabrication. MOSIS takes care of front end foundry tasks such as data preparation and obtaining masks as well as placing the orders and delivering the finished product. This paper gives a brief overview of the MOSIS service. In addition, it provides an update of the technologies available including, flip-chip MCM fabrication and assembly, 0.35 micron CMOS, bare die bumping, and MEMs technologies.

Paper Details

Date Published: 20 July 1998
PDF: 5 pages
Proc. SPIE 3328, Smart Structures and Materials 1998: Smart Electronics and MEMS, (20 July 1998); doi: 10.1117/12.320182
Show Author Affiliations
Jennifer Peltier, Univ. of Southern California (United States)
Wes Hansford, Univ. of Southern California (United States)

Published in SPIE Proceedings Vol. 3328:
Smart Structures and Materials 1998: Smart Electronics and MEMS
Vijay K. Varadan; Paul J. McWhorter; Richard A. Singer; Michael J. Vellekoop, Editor(s)

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