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Proceedings Paper

MEMS packaging: state of the art and future trends
Author(s): Andre Bossche; Carmen V. B. Cotofana; Jeff R. Mollinger
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Paper Abstract

Now that the technology for Integrated sensor and MEMS devices has become sufficiently mature to allow mass production, it is expected that the prices of bare chips will drop dramatically. This means that the package prices will become a limiting factor in market penetration, unless low cost packaging solutions become available. This paper will discuss the developments in packaging technology. Both single-chip and multi-chip packaging solutions will be addressed. It first starts with a discussion on the different requirements that have to be met; both from a device point of view (open access paths to the environment, vacuum cavities, etc.) and from the application point of view (e.g. environmental hostility). Subsequently current technologies are judged on their applicability for MEMS and sensor packaging and a forecast is given for future trends. It is expected that the large majority of sensing devices will be applied in relative friendly environments for which plastic packages would suffice. Therefore, on the short term an important role is foreseen for recently developed plastic packaging techniques such as precision molding and precision dispensing. Just like in standard electronic packaging, complete wafer level packaging methods for sensing devices still have a long way to go before they can compete with the highly optimized and automated plastic packaging processes.

Paper Details

Date Published: 20 July 1998
PDF: 8 pages
Proc. SPIE 3328, Smart Structures and Materials 1998: Smart Electronics and MEMS, (20 July 1998); doi: 10.1117/12.320166
Show Author Affiliations
Andre Bossche, Delft Univ. of Technology (Netherlands)
Carmen V. B. Cotofana, Delft Univ. of Technology (Netherlands)
Jeff R. Mollinger, Delft Univ. of Technology (Netherlands)

Published in SPIE Proceedings Vol. 3328:
Smart Structures and Materials 1998: Smart Electronics and MEMS
Vijay K. Varadan; Paul J. McWhorter; Richard A. Singer; Michael J. Vellekoop, Editor(s)

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