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Proceedings Paper

Planarization of metallic parts for single- and multilevel (S)LIGA
Author(s): Chantal G. Khan Malek; Robert L. Wood; Perry Genova
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Paper Abstract

The quality of surface finish and precise height of LIGA components produced by electroplating has been studied. Planarization is often required to meet specifications for both basic LIGA processing (single level) and extended LIGA processing (multi-level). The HI-MEMS Alliance has successfully developed such a planarization process.

Paper Details

Date Published: 20 July 1998
PDF: 7 pages
Proc. SPIE 3328, Smart Structures and Materials 1998: Smart Electronics and MEMS, (20 July 1998); doi: 10.1117/12.320158
Show Author Affiliations
Chantal G. Khan Malek, Louisiana State Univ. (France)
Robert L. Wood, Microelectronics Ctr. of North Carolina (United States)
Perry Genova, IEP Group, Inc. (United States)

Published in SPIE Proceedings Vol. 3328:
Smart Structures and Materials 1998: Smart Electronics and MEMS
Vijay K. Varadan; Paul J. McWhorter; Richard A. Singer; Michael J. Vellekoop, Editor(s)

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