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Proceedings Paper

CMOS MEMS technology and CAD: the case of thermal microtransducers
Author(s): Henry Baltes; Oliver Brand; Oliver Paul
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Paper Abstract

Thermally-based transducer microsystems can be made by using CMOS IC technology, post-CMOS micromachining or deposition, and flip-chip packaging. Technology steps, materials, and physical effects pertinent to thermal microtransducers are summarized together with microheater, thermistor, thermopile, thermal isolation, and heat sink structures. An infrared intrusion detector, a thermal air flow sensor, and thermally excited microresonators for acoustic and chemical sensing serve as demonstrators. We discuss the characterization of process-dependent properties of CMOS materials crucial for thermal microtransducer CAD.

Paper Details

Date Published: 20 July 1998
PDF: 11 pages
Proc. SPIE 3328, Smart Structures and Materials 1998: Smart Electronics and MEMS, (20 July 1998); doi: 10.1117/12.320157
Show Author Affiliations
Henry Baltes, ETH Zurich (Switzerland)
Oliver Brand, ETH Zurich (Switzerland)
Oliver Paul, ETH Zurich (Germany)


Published in SPIE Proceedings Vol. 3328:
Smart Structures and Materials 1998: Smart Electronics and MEMS
Vijay K. Varadan; Paul J. McWhorter; Richard A. Singer; Michael J. Vellekoop, Editor(s)

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