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Proceedings Paper

Compact modular MWIR FPA imager with exceptional sensitivity and resolution
Author(s): John J. Forsthoefel; John G. Sanders; Mike Davis; Fred Nicol
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Paper Abstract

As high density staring focal plane array (FPA) detectors become available, imaging IR sensors must be constructed to display high performance images in compact packages. To make best use of engineering development efforts, the sensor packages must be designed to address multiple mission environments and to create displays for several detector types. Cincinnati Electronics has developed a 640 X 512 pixel InSb FPA and a 2-axis, micro-scanned, 256 X 256 array. These FPA alternatives have been incorporated into a new design sensor package utilizing a compact set of electronics and a miniature Stirling cryo-cooler. This camera design addresses a variety of missions ranging from an open frame OEM package to custom environmental housings. The detector interface can be electrically reconfigured to a variety of IR detectors, including medium or high-density arrays, as well as one or two dimensionally micro-scanned systems. This new packaging design demonstrates improvements over current systems in several performance areas: weight, package size, system sensitivity, system resolution, and fast Non-Uniformity Corrections. The device supports local or completely remote command operation. Rapid in-field reconfiguration is supported from an external connection. Digital and TV-standard analog display video are supported. Several examples are given of system tradeoffs in resolution and sensitivity to optimize system performance, with different FPA configurations for specific mission requirements.

Paper Details

Date Published: 26 August 1998
PDF: 14 pages
Proc. SPIE 3377, Infrared Imaging Systems: Design, Analysis, Modeling, and Testing IX, (26 August 1998); doi: 10.1117/12.319367
Show Author Affiliations
John J. Forsthoefel, Cincinnati Electronics Corp. (United States)
John G. Sanders, Cincinnati Electronics Corp. (United States)
Mike Davis, Cincinnati Electronics Corp. (United States)
Fred Nicol, Cincinnati Electronics Corp. (United States)


Published in SPIE Proceedings Vol. 3377:
Infrared Imaging Systems: Design, Analysis, Modeling, and Testing IX
Gerald C. Holst, Editor(s)

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