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Proceedings Paper

Deformation behavior of shape memory alloy under complex loading conditions (modeling and constitutive relations)
Author(s): Meng Ye; Masataka Tokuda; Petr Sittner; B. Bundara
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Paper Abstract

The thermo-mechanical behavior of polycrystalline shape memory alloy (SMA) under complex loading (uni-axial loading, multiaxial loading and varying temperature) has been studied by experiments in our laboratory for several years. Recently, the research has been extended theoretically, and a mechanical model of polycrystalline SMA and the corresponding mesoscopic constitutive equations have been developed. The model presented in this paper is constructed on the basis of the crystal plasticity and the deformation mechanism of SMA. The variants in the crystal grains and the orientations of crystal grains in the polycrystal are considered in the proposed model and the derived constitutive equations. The volume fraction of the martensite variants in the transformation process and the influence of the stress state on the transformation process are considered, as well. Besides, the deformation behavior of SMA in the heating and cooling process under different stress states is highlighted in this paper. Some calculation results obtained by the constitutive equations, which are derived from the model, are presented and compared with the experimental results. The deformation behavior of SMA under complex loading conditions can be well reproduced or predicted by the calculation based on the constitutive equations derived from the model.

Paper Details

Date Published: 24 July 1998
PDF: 12 pages
Proc. SPIE 3323, Smart Structures and Materials 1998: Mathematics and Control in Smart Structures, (24 July 1998); doi: 10.1117/12.316312
Show Author Affiliations
Meng Ye, Mie Univ. (Japan)
Masataka Tokuda, Mie Univ. (Japan)
Petr Sittner, Institute of Physics (Czech Republic)
B. Bundara, Mie Univ. (Japan)


Published in SPIE Proceedings Vol. 3323:
Smart Structures and Materials 1998: Mathematics and Control in Smart Structures
Vasundara V. Varadan, Editor(s)

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