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Proceedings Paper

High-speed 3D shape measurement using a nonscanning multiple-beam confocal imaging system
Author(s): Mitsuhiro Ishihara; Hiromi Sasaki
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Paper Abstract

This paper describes a high-speed 3D shape measurement system for in-line semiconductor package inspections. The system consists of three parts. One is an optics and sensor for confocal imaging, which we call a non-scanning multiple- beam confocal microscope. The microscope can get a confocal image within very short time because XY-scanning, which is required in conventional confocal microscopes, is not needed. Another is the algorithm that performs reconstructing the object surfaces accurately from a few confocal images. The last is a mechanism that performs shifting the focused plane of the microscope very quickly. This experimental system can measure objects having a space of 9.6 X 9.6 X 0.64 mm in less than 0.4 s with an accuracy in the order of 1 micrometers .

Paper Details

Date Published: 30 June 1998
PDF: 8 pages
Proc. SPIE 3478, Laser Interferometry IX: Techniques and Analysis, (30 June 1998); doi: 10.1117/12.312975
Show Author Affiliations
Mitsuhiro Ishihara, Takaoka Electric Manufacturing Co., Ltd. (Japan)
Hiromi Sasaki, Takaoka Electric Manufacturing Co., Ltd. (Japan)


Published in SPIE Proceedings Vol. 3478:
Laser Interferometry IX: Techniques and Analysis
Malgorzata Kujawinska; Gordon M. Brown; Mitsuo Takeda, Editor(s)

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