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Proceedings Paper

Real-time amine monitoring and its correlation to critical dimension control of chemically amplified resists for sub-0.25-um geometries
Author(s): Will Conley; Carl P. Babcock; John A. Lilygren; Clifford P. Sandstrom; Nigel R. Farrar; John Piatt; Devon A. Kinkead; William Goodwin; Oleg P. Kishkovich; John K. Higley; Phil Cate
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Paper Abstract

One such issue is the quantitative control of critical dimension (CD) and how to calibrate fab contamination levels to linewidth control. Since most fabs build several generations of devices, contamination levels for older generations may not be suitable for new generations. Therefore, studies to control CD for each generation are required to determine the effectiveness of filtration schemes. In this paper the authors have investigated CD control for imaging dimensions from 0.25 micrometers to 0.15 micrometers . We have also correlated this data back to chemical monitoring levels to determine CD vs. PED stability for these geometry's to determine the contamination level tolerance. Additionally, the authors have generated process windows to determine the effect such delays have on process windows.

Paper Details

Date Published: 29 June 1998
PDF: 7 pages
Proc. SPIE 3333, Advances in Resist Technology and Processing XV, (29 June 1998); doi: 10.1117/12.312479
Show Author Affiliations
Will Conley, Cypress Semiconductor Corp. (United States)
Carl P. Babcock, Cypress Semiconductor Corp. (United States)
John A. Lilygren, Cypress Semiconductor Corp. (United States)
Clifford P. Sandstrom, Cypress Semiconductor Corp. (United States)
Nigel R. Farrar, Hewlett-Packard Co. (United States)
John Piatt, Extraction Systems Inc. (United States)
Devon A. Kinkead, Extraction Systems Inc. (United States)
William Goodwin, Extraction Systems Inc. (United States)
Oleg P. Kishkovich, Extraction Systems Inc. (United States)
John K. Higley, Extraction Systems Inc. (United States)
Phil Cate, Extraction Systems Inc. (United States)


Published in SPIE Proceedings Vol. 3333:
Advances in Resist Technology and Processing XV
Will Conley, Editor(s)

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