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Proceedings Paper

Novel novolak block copolymers for advanced i-line resists
Author(s): Stan F. Wanat; M. Dalil Rahman; Sunit S. Dixit; Ping-Hung Lu; Douglas S. McKenzie; Michelle M. Cook
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Paper Abstract

in order to meet customer driven functional criteria for modern i-line resists, formulations have become increasingly more complicated. Often mixtures of both the photoactive compounds and resins are necessary to balance and optimize dissolution inhibition, photosensitivity and resolution. Mixtures of fractionated novolak resins along with low molecular weight (Mw) speed enhancing resin additives were used to attain desired properties. Scumming tendencies increased as the concentration of the low Mw additives increased. Novel resins were synthesized by incorporating fully formed low Mw additives into the synthetic recipes along with the phenolic monomers and formaldehyde. These resins were characterized by gel permeation chromatography, NMR and by functional comparison to traditional formulations. When formulated with small amounts of low Mw additives, photospeeds could be increased while increasing thermal resistance and reducing scumming tendencies. Additional resist performance enhancements were possible when the new resins were fractionated to remove low Mw oligomers and unreacted starting materials. The need for use of small amounts of low Mw speed enhancers to the formulations with the new resins substantiates earlier work on the optimization of resist formulations.

Paper Details

Date Published: 29 June 1998
PDF: 11 pages
Proc. SPIE 3333, Advances in Resist Technology and Processing XV, (29 June 1998); doi: 10.1117/12.312451
Show Author Affiliations
Stan F. Wanat, Clariant Corp. (United States)
M. Dalil Rahman, Clariant Corp. (United States)
Sunit S. Dixit, Clariant Corp. (United States)
Ping-Hung Lu, Clariant Corp. (United States)
Douglas S. McKenzie, Clariant Corp. (United States)
Michelle M. Cook, Clariant Corp. (United States)


Published in SPIE Proceedings Vol. 3333:
Advances in Resist Technology and Processing XV
Will Conley, Editor(s)

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